Advanced Packaging Development Engineer

Quick Facts

• Role: Advanced Packaging Development Engineer

• Focus: 2.5D/3D advanced packaging integration and technology development

Description

Drive next-generation 2.5D and 3D packaging technologies from early concept through qualification and high-volume manufacturing. Lead advanced packaging architecture definition, experimental test vehicle development, and chip-package interaction reliability work, coordinating across silicon design, SI/PI, and thermal teams. Direct foundry and OSAT partners to align on technology roadmaps and process capability targets.

Responsibilities

• Develop and qualify advanced packaging architectures (hybrid bonding, fine-pitch microbumps, interposers, TSVs)

• Define and execute test vehicles; establish packaging design rules; lead characterization for novel interconnect validation

• Assess CPI risks, correlate mechanical/thermal stress behaviors, and partner with failure analysis teams to address yield, material, and structural challenges

• Drive cross-functional co-optimization across architecture, silicon design, SI/PI, and thermal for system trade-offs (performance, power, reliability, cost)

• Lead external technology partners (foundries, OSATs) on roadmaps, process capability targets, schedules, and high-volume ramp

Requirements

• BS and 10+ years of relevant industry experience

• Strong technical background in 2.5D/3D packaging and semiconductor integration schemes (hybrid bonding, interposers, fine-pitch microbumps, TSVs)

• Solid grasp of BEoL/MEoL interconnect processing, wafer-level packaging, and advanced assembly flows

• Understanding of packaging materials, thermo-mechanical reliability, and chip-package interaction failure mechanisms

• Systems mindset to balance package-level choices against silicon, electrical, thermal, and manufacturing constraints

• Experience using layout, physical design, modeling tools, and engineering data analysis

• Proven record collaborating with and driving external foundries, OSATs, and/or material vendors

• Excellent cross-functional communication and collaboration skills