Principal Reliability Engineer

Quick Facts

• Role: Principal Reliability Engineer

• Focus: New product qualification and reliability testing for semiconductor products

Description

Define and execute strategies for new product/process qualification, including reliability and stress testing activities. Build qualification plans and schedules, define qualification hardware requirements, and coordinate with labs, cross-functional teams, and reliability suppliers. Produce qualification reports and support failure analysis and customer reliability information needs.

Responsibilities

• Define qualification strategy and create qualification plans for new products/processes

• Create qualification schedules and provide frequent status updates

• Define qualification hardware requirements (e.g., HTOL/HAST boards) and work with testing labs to design and deliver qual hardware

• Drive robust, error-free execution of qualification and reliability testing per agreed plans

• Manage reliability suppliers/subcontractors executing qualification tests

• Support qualification of new vendors and reliability evaluation of design/manufacturing/material changes

• Write product qualification reports and related documentation

• Lead or support failure analysis activities as needed to complete qualification/reliability evaluation

• Support customer quality and reliability information requirements

Requirements

• Bachelor’s degree in Electrical and Electronics Engineering, Mechanical/Materials Engineering, or related engineering fields with 10+ years of related experience (Masters/PhD desired with 5+ years)

• 5+ years of product qualification and reliability testing experience for semiconductor products

• Knowledge of CMOS and Bi-CMOS fabrication processes, packaging technologies, and qualification project planning/scheduling

• In-depth stress testing knowledge (HTOL, HAST, TC, ESD, LU) and standards (JEDEC, AEC, Telcordia)

• Experience with high-speed analog devices (drivers and TiA) and their performance testing/characteristics

• Experience partnering with vendors for HTOL stress pattern bring-up, test execution, and hardware design

• Hands-on data scoping and HTOL setup experience

• Understanding of IC fabrication, packaging processes, and product testing

• Knowledge of failure mechanisms in silicon and packaging technologies

• Reliability data statistical analysis experience (plus)

• Strong communication, interpersonal, planning, and organization skills; ability to work independently and in teams

• FMEA and risk assessment knowledge (plus)

Benefits

• Eligible to participate in bonus and equity plans, including new-hire equity grant and annual equity refreshers