Associate Quantum Hardware Assembly R&D Engineer

Quick Facts

• Role: Entry-level Associate Quantum Hardware Assembly R&D Engineer (Quantum Hardware team)
• Focus: R&D of electronic packaging technologies for next-generation superconducting quantum devices
• Work style: Hands-on, collaborative, fully on-site

Description

Develop and optimize electronic packaging and assembly processes for next-generation quantum devices, supporting research, development, fabrication, and characterization. Evaluate assembly yields and package performance using electrical, mechanical, and physical characterization methods, and troubleshoot packaging-related issues through root-cause investigations. Document experiments and collaborate with multidisciplinary teams to mature hardware integration and processes.

Responsibilities

• Develop and optimize assembly processes for next-generation quantum devices, including SMT, die attach, flip-chip assembly, and related packaging techniques
• Evaluate assembly yields, process capability, and package performance via electrical, mechanical, and physical characterization
• Support hardware integration, process troubleshooting, and root-cause investigations for assembly and packaging issues
• Document methods, results, and recommendations through technical reports, presentations, and formal documentation
• Collaborate with multidisciplinary teams across IBM Quantum to support hardware development and technology maturation

Requirements

• Bachelor’s degree in Materials Science and Engineering, Chemical Engineering, Mechanical Engineering, Electrical Engineering, Chemistry, Physics, or a related technical field
• Ability to independently troubleshoot and solve complex technical problems
• Ability to work effectively with interdisciplinary teams across engineering and science disciplines
• Strong growth mindset with desire to continuously learn and develop new skills
• Strong attention to detail and commitment to high-quality work

Benefits

• Opportunity to develop advanced electronic packaging technologies for next-generation quantum computing systems
• Hands-on engineering and experimentation with state-of-the-art assembly and characterization tools
• Collaboration with world-class scientists and engineers in a multidisciplinary environment

Preferred Qualifications

• Academic, internship, or research experience in materials development, characterization, or process engineering
• Hands-on experience with electronic packaging and assembly techniques (die attach, flip-chip assembly, SMT, soldering)
• Experience with optical microscopy, SEM, cross-sectioning, metrology, and basic electrical testing
• Familiarity with process development, statistical process control, yield analysis, or DOE methodologies