Advanced Packaging Development Engineer

Quick Facts

• Role: Advanced Packaging Development Engineer

• Focus: 2.5D/3D packaging integration and technology development

Description

Lead the definition, development, and qualification of advanced 2.5D/3D packaging technologies from early concept through qualification. Drive test vehicle design and characterization to validate novel interconnect concepts, while assessing chip-package interaction (CPI) risks and reliability through mechanical/thermal stress correlation. Co-optimize package-level trade-offs across architecture, silicon, SI/PI, thermal, and manufacturing, and direct external foundry and OSAT partners through technology roadmaps toward high-volume manufacturing ramp.

Responsibilities

• Develop advanced packaging architectures featuring hybrid bonding, fine-pitch microbumps, interposers, and TSVs

• Define experimental test vehicles, establish packaging design rules, and lead characterization

• Assess CPI risks and correlate mechanical and thermal stress behaviors with failure analysis teams

• Collaborate cross-functionally on holistic system trade-offs across performance, power, reliability, and cost

• Lead external technology partners on process capability targets, development schedules, and high-volume manufacturing ramp

Requirements

• Bachelor’s degree

• Strong technical background in 2.5D/3D packaging and semiconductor integration schemes (hybrid bonding, interposers, fine-pitch microbumps, TSVs)

• Solid understanding of BEoL/MEoL interconnect processing, wafer-level packaging, and advanced assembly flows

• Understanding of packaging materials, thermo-mechanical reliability, and chip-package interaction failure mechanisms

• Systems mindset to balance package-level choices with silicon, electrical, thermal, and manufacturing constraints

• Experience using layout, physical design, or modeling tools with engineering data analysis

• Proven track record collaborating with and driving external foundries, OSATs, or material vendors

• Excellent communication and collaboration across cross-functional hardware teams

Education & Experience

B.S., M.S., or Ph.D. in Physics, Materials Science, Electrical Engineering, Mechanical Engineering, Computer Engineering, or a related technical discipline.