IC Packaging Integration Engineer

Quick Facts

• Lead IC packaging integration and architecture efforts across cross-functional teams.
• Partner with OSAT/third parties to move advanced packaging from concept to HVM.
• Drive packaging technology development and support NPI through qualification and high-volume production.

Description

Work with cross-functional teams and lead package integration and architecture efforts. Partner with OSAT/third parties to take packaging solutions from concept to HVM, including package, module, and technology development. Drive innovative packaging solutions through mass production readiness while meeting electrical, mechanical, thermal, reliability, and fit requirements.

Responsibilities

• Lead package co-design efforts with Silicon, Packaging, and Systems engineering teams to ensure package requirements are met.
• Drive package technology development with broad impact, including new technology/structures, enhanced performance, and lower cost.
• Collaborate with assembly partners across development, NPI, qualification, and high-volume production.
• Create package design documentation, design rules, technical risk assessments, and package checklists for silicon-to-development and production release.

Requirements

• BS and 10+ years of relevant industry experience.
• Experience in semiconductor packaging design and process & technology development.
• Strong understanding of cross-functional packaging areas: Si floor plan, package layout and architecture, enabling process technologies, thermal, mechanical, SI/PI, materials and component/system-level reliability, testing, and FA.
• Knowledge of advanced packaging technologies for high-density/high-performance interconnects under thermo-mechanical, reliability, and cost constraints.
• Strong problem-solving with physics and fundamental knowledge.
• Excellent communication skills to work with internal cross-functional teams and overseas suppliers.
• Multi-functional coverage including package layout (Cadence APD/Allegro), signal/power integrity, thermal, design rules, BOM, design for manufacturing, reliability, and cost.
• Ability to work independently and take on projects with minimal supervision.

Benefits

Not specified in the posting.