Radar and RF Electronics Engineer (Solid-State Microelectronics & Advanced Packaging)

Quick Facts

• Role: Engineer focused on solid-state technologies and advanced packaging for RF and opto-electronics engineering

• Reporting: Provides bi-weekly updates to management on accomplishments, technical risks, and strategies

Description

You will lead solid-state technologies and advanced packaging within the RF and opto-electronics engineering branch, supporting DoD radar and Electronic Warfare systems for maritime, ground, and airborne Active Electronically Scanned Array (AESA) platforms. The role includes overseeing RF/OE microelectronics investments and directing the identification, maturation, and transition of advanced packaging and solid-state microelectronics R&D into operational use. You will mitigate technical risks for critical microelectronics technologies and report progress regularly to management.

Responsibilities

• Lead the Solid-State Technologies and Advanced Packaging Division

• Provide bi-weekly reports detailing accomplishments, technical risks, and strategies

• Oversee RF and opto-electronic investments for relevant OUSD(R&E) Microelectronics Directorate programs

• Mitigate risk for critical microelectronics technologies for maritime, ground, and airborne AESA platforms

• Direct national-level strategic investments (e.g., T&AM, CHIPS Act ME Commons)

• Lead identification, maturation, and transition of S&T/R&D in advanced packaging and solid-state microelectronics for DoD radar and Electronic Warfare systems

Requirements

• US citizenship

• Suitable for federal employment

• Obtain and maintain required interim and/or final security clearance prior to entrance on duty

• Pass pre-employment drug test (including marijuana) and comply with random testing

• DAWIA certification in the functional area and tier assigned within required timeframes

• Males born after 12-31-59 registered for Selective Service

• At least one year of specialized experience at ND-04 (GS-12/13 equivalent) or higher, as a professional engineer providing technical guidance on packaging and solid-state microelectronics development and R&D for radar and Electronic Warfare systems

• Meet OPM basic education requirements for professional engineering (e.g., ABET-accredited engineering degree OR FE/written licensure OR Engineer Intern/EIT/PE licensure OR qualifying coursework/related degree with supervised professional engineering experience)

Benefits

Federal government benefits package. Eligibility depends on position type (full-time, part-time, or intermittent).