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September 14, 2026
Principal Digital Design Engineer / Chip Lead
Senior
178,000 - 389,000 USD/yr
San Jose, CA
Apply now
Quick Facts
- Role: Digital Design Engineer / Chip Lead
- Focus: Chip architecture, RTL design, timing closure, synthesis, verification coordination, and tape-out ownership for high-speed interface PHY innovations
Description
As a Digital Design Engineer / Chip Lead, you are the technical anchor of a deliberately small, senior team bringing high-speed interface innovations from architecture to tape-out. The Interface Pathfinding team drives performance-scaling innovation across circuits, signaling, packaging, and interconnects, with a core emphasis on silicon-based validation of novel PHY solutions.
What You’ll Own
Chip Architecture & Integration
- Define top-level chip architecture
- Partition responsibilities across hard and soft IP blocks
- Own integration of hard macros alongside third-party soft IP
RTL Design
- Author, review, and maintain synthesizable RTL (SystemVerilog) for soft IP control blocks, CSR/register file, clocking control logic, and top-level integration
Timing Closure Leadership
- Develop and own chip-level timing constraints (SDC)
- Define clock domain crossing strategy
- Provide timing budgets per block to the Physical Design engineer
Synthesis
- Drive logic synthesis (DC / Genus)
- Guide optimization for PPA targets across all design blocks
Verification Coordination
- Partner with DV staff to apply assertion-based verification, coverage-driven verification, formal methods, and constrained-random techniques
- Ensure high quality verification of control logic, interfaces, and system behaviors
IP Management
- Define interfaces between PHY hard macro, third-party soft IP, and internally designed blocks
- Manage IP integration agreements and vendor coordination
Tape-Out Ownership
- Own and drive the tape-out checklist sign-off process
- Coordinate across Physical Design, Verification, and analog team members for clean foundry handoff
Design Documentation
- Author architecture specifications, block-level design specifications, and interface control documents
Follow-On Roadmap
- Capture design decisions, lessons learned, and architectural rationale to accelerate follow-on chip development
What You Bring
Required
- BS, MS, or PhD in Electrical Engineering, Computer Engineering, or related field
- 10+ years of ASIC/digital design experience with at least one prior tape-out in a chip lead, design lead, or senior designer role
- Expert-level proficiency in SystemVerilog RTL design and coding best practices
- Strong experience with logic synthesis tools (Synopsys Design Compiler or Cadence Genus) and static timing analysis (PrimeTime or Tempus)
- Proficiency with industry-standard RTL simulation and debug tools (VCS, Xcelium, or equivalent; Verdi or DVE for waveform debug)
- Solid understanding of CDC analysis methodologies and tools (SpyGlass, JasperGold CDC, or equivalent)
- Demonstrated experience integrating hard and soft IP blocks in a mixed-signal or PHY-adjacent chip environment
- Ability to work effectively as a technical lead on a small team; comfortable making decisions with incomplete information and owning outcomes
- Strong written communication skills; role produces specifications, not just code
- Experience partnering with design verification teams to define verification plans, review coverage metrics, and drive closure of functional and corner-cases prior to tape-out
- Expected to be proficient in leveraging AI for productivity
Preferred
- Experience with high-speed PHY architectures (SerDes, DDR, or equivalent analog I/O structures)
- Familiarity with I2C management bus architecture, Eye Monitor control logic, or PRBS-based error counting implementations
- Experience with DFT strategy definition including scan insertion, ATPG planning, and boundary scan for high-speed I/O
- Familiarity with OTP/fuse-based trim and calibration architectures for PHY analog parameters
- Prior experience in a small team or startup-like environment where role boundaries are defined by need rather than org chart
Why This Role
- Full technical ownership of a chip from day one; no waiting for a senior engineer to hand you a subsystem
- Close collaboration with analog designers, including deep SerDes and clocking expertise; analog and digital work as collaborators
- Small and senior team; fast decisions and trusted judgment
- Join an active program with momentum; technical leadership directly shapes trajectory and scope going forward
Benefits
- Choice of medical, dental and vision plans
- Benefit programs to protect income if unable to work due to illness or injury
- Paid family leave
- Robust paid time-off program and paid holidays
- Additional details available in the Benefits Guide posted on micron.com/careers/benefits
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