Thermal Engineer

Quick Facts

• Role: Thermal Engineer

• Experience: 7+ years in thermal management for IT hardware (chip/package to system)

Description

Design and optimize thermal solutions for data center hardware, from chip and package levels through board- and system-level cooling architectures. Use thermal modeling and simulation to predict temperature profiles and identify bottlenecks, then validate performance through lab testing and experimentation. Partner across mechanical, electrical, software, and systems engineering teams to integrate thermal strategies into hardware designs and support production readiness.

Responsibilities

• Design and optimize thermal solutions for data center hardware (chips, power modules, system cooling)

• Evaluate thermal performance at chip, package, and board levels; address power density, heat dissipation, and TIM challenges

• Perform thermal modeling and simulation to identify thermal bottlenecks

• Collaborate cross-functionally to integrate thermal management from concept to mass production

• Set up and run thermal experiments with data acquisition and troubleshooting

• Design and select thermal components (cold plates, heat sinks, fans, vapor chambers, TIMs)

• Define and implement thermal control algorithms for dynamic power and cooling

• Conduct feasibility studies and trade-off analyses to improve thermal efficiency

• Work with suppliers and manufacturers to develop custom thermal components and ensure production quality

Requirements

• Bachelor’s degree in Mechanical Engineering, Thermal Engineering, or a related field (Master’s preferred)

• 7+ years of industry experience in thermal design, simulation, and validation for IT hardware

• Proficiency in thermal simulation software and CAD tools

• Strong understanding of heat transfer, thermodynamics, and fluid mechanics for electronics cooling

• Hands-on thermal testing experience (thermocouples, infrared cameras, wind tunnels, P-Q characterization)

• Experience with chip/package-level thermal analysis and die/package heat spreading and modeling

• Ability to analyze experimental data, identify root causes, and implement corrective actions

• Strong problem-solving skills, including first-principles calculations

Benefits

• Work on mission-critical hardware thermal reliability, efficiency, and longevity

• Cross-disciplinary collaboration across thermal, mechanical, electrical, software, and systems engineering

• Opportunity to support designs through validation and production ramp-up