Process Integration, Yield and Defect Reduction Engineering Lead

Quick Facts

The NM Si Manufacturing Integration Team is seeking a highly motivated engineering professional with a strong technical background to grow into a Process Integration (PI) Team Lead role. This role reports to the NM Si Manufacturing Integration Director and supports Intel’s advanced packaging manufacturing operations.

Description

Collaborate with Advanced Packaging HVM engineering and factory operations teams to support the transfer, ramp, and sustainment of advanced packaging technologies. Ensure successful execution against foundry customer commitments while driving continuous improvements in yield, quality, reliability, and manufacturing efficiency. Use strong problem-solving skills and data-driven approaches to drive process improvements in a high-volume manufacturing environment.

Responsibilities

• Support transfer, ramp, and sustainment of advanced packaging technologies
• Drive continuous improvements in yield, quality, reliability, and manufacturing efficiency
• Analyze defectivity and parametric data to identify yield limiters
• Apply statistical methods to control and improve manufacturing processes
• Lead technology development, transfer, and manufacturing ramp activities
• Lead cross-functional teams and influence technical decisions across organizations
• Develop inline monitoring systems, dashboards, and manufacturing health metrics

Requirements

Minimum Qualifications:

• Bachelor’s or Master’s degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, Materials Science, Microelectronics Engineering, Chemistry, Physics, or a related technical field
• 5+ years of experience in semiconductor manufacturing or advanced packaging

Additional (Minimum) Experience Areas:

• 5+ years of experience in process integration or defect reduction for backend interconnect or advanced packaging processes
• 3+ years of experience applying Design of Experiments (DOE) methodologies
• 5+ years of experience in data analysis and statistical process control using tools such as JMP, SQL, PCS, or similar platforms

Preferred Qualifications

• Strong understanding of semiconductor process flow and advanced packaging technologies
• Knowledge of process capability analysis, specification management, statistical variation, and process control methodologies
• Experience with yield analysis and defect reduction methodologies
• Experience applying FMEA techniques
• Experience developing inline monitoring systems, dashboards, and manufacturing health metrics
• Demonstrated ability to lead technology development, transfer, and manufacturing ramp activities
• Strong project management, communication, and stakeholder management skills
• Ability to lead cross-functional teams and influence technical decisions across multiple organizations

Benefits

• Competitive pay with stock bonuses
• Health, retirement, and vacation benefits
• Annual salary range (US): $140,830.00 - 198,820.00 USD
• On-site work model required