CAD/PCB Design Engineer, Pixel Phones

Minimum qualifications:

• Bachelor's degree in Electrical Engineering, Computer Engineering, Electronics, a related field, or equivalent practical experience.
• 2 years of experience in Printed Circuit Board (PCB) design and Flexible Printed Circuit (FPC) design, with experience in leading Computer-Aided Design (CAD) software tools.
• 2 years of experience utilizing Cadence Allegro tools, specifically with Allegro Constraints Manager for managing and implementing design rules.

Preferred qualifications:

• Experience with PCB design tools and methodologies.
• Experience in executing high-speed board designs and layouts.
• Experience in both FPC and rigid-flex layout techniques.
• Experience across all phases of hardware development, from initial schematic entry and meticulous manual constraint generation to meeting all design requirements and producing polished board layouts.
• Knowledge of mechanical design outline formats, ensuring seamless integration and collaboration between electrical and mechanical design teams.
• Familiarity with high-density Ball-Grid Array (BGA) packages, as well as the application of blind and buried vias for optimal performance.

About the job

The Google Pixel team focuses on designing and delivering the world's most helpful mobile experience. The team works on shaping the future of Pixel devices and services through some of the most advanced designs, techniques, products, and experiences in consumer electronics. This includes bringing together the best of Google’s artificial intelligence, software, and hardware to build global smartphones and create transformative experiences for users across the world.The US base salary range for this full-time position is $126,000-$181,000 + bonus + equity + benefits. Our salary ranges are determined by role, level, and location. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific salary range for your preferred location during the hiring process.

Responsibilities

• Drive the mechanical and electrical design of Printed Circuit Boards (PCBs) from initial concept through mass production, including outline creation, layer stack-up definition, optimal component placement, and high-speed signal routing.
• Collaborate closely with board fabrication vendors to establish and implement precise impedance control rules, while ensuring adherence to Design for Manufacturing (DFM), Design for Assembly (DFA), and Design for Testability (DFT) guidelines.
• Serve as a key interface between Electrical Engineers, PCB Designers, Mechanical Engineers, and Fabricators, facilitating seamless communication and problem-solving throughout the product development lifecycle.
• Foster cross-functional partnerships with Electrical Engineering, Product Design, and Design for Manufacturability (DFM)/Design for Assembly (DFA) teams to optimize designs for performance, manufacturability, and cost-effectiveness.
• Utilize advanced Computer-Aided Design (CAD) tools and methodologies to create PCB layouts, ensuring signal integrity and power delivery meet performance requirements.