Minimum qualifications:
- Bachelor’s degree in Electrical Engineering, Computer Engineering, Computer Science, Physics, or a specialized field (e.g., Optics, Sensors, Audio/DSP, etc.), or equivalent practical experience.
- 4 years of experience working in failure analysis and executing Design of Experiments (DOE).
- Experience with camera product design and manufacturing.
Preferred qualifications:
- Master's degree or PhD in Electrical Engineering, Computer Engineering, Physics, or a related field (e.g., Optics, Sensors, Audio/DSP).
- 10 years of consumer electronics camera design or manufacturing experience.
- Experience performing failure analysis on camera products, including root cause determination and utilizing relevant investigative tools.
- Experience conducting Finite Element Analysis (FEA) on consumer electronic products or components.
- Knowledge of camera reliability testing methodologies and manufacturing processes.
About the job
The Camera Hardware team inside the Tech Engineering Imaging and Vision (TEIV) group is responsible for developing camera hardware for all Google’s Pixel products. In this role, you will work with internal cross-functional teams and external partners to design and develop camera components, modules, and integrate them into product systems. You will have the responsibility of the entire life-cycle of projects including new technology and road map products.
As a Camera Hardware FA(Failure Analysis)/CA(Corrective Action) Engineer, you will lead investigations into complex camera reliability and performance issues related to mechanical/electrical/optical design, system integration, and manufacturing. You will partner closely with internal labs and cross-functional engineering teams, you will utilize investigative FA techniques and Design of Experiments (DOEs) to determine root causes and validate corrective actions. You will then apply these findings to optimize camera module designs and enhance reliability of roadmap products.
Google's mission is to organize the world's information and make it universally accessible and useful. Our Devices & Services team combines the best of Google AI, Software, and Hardware to create radically helpful experiences for users. We research, design, and develop new technologies and hardware to make our user's interaction with computing faster, seamless, and more powerful. Whether finding new ways to capture and sense the world around us, advancing form factors, or improving interaction methods, the Devices & Services team is making people's lives better through technology.
The US base salary range for this full-time position is $147,000-$216,000 + bonus + equity + benefits. Our salary ranges are determined by role, level, and location. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific salary range for your preferred location during the hiring process.
Please note that the compensation details listed in US role postings reflect the base salary only, and do not include bonus, equity, or benefits. Learn more about benefits at Google.
Responsibilities
- Direct camera failure analysis investigations, driving to the root cause determination through failure reproduction and directing FA lab efforts.
- Utilize Design of Experiments (DOEs) to systematically understand failure mechanisms and validate proposed corrective actions.
- Leverage Finite Element Analysis (FEA) to support root cause investigations, perform virtual experiments, and optimize camera module structure and performance.
- Partner with Asia and US Product Design, Module, Reliability, and Manufacturing teams to proactively address and solve camera-related design, reliability, and manufacturing challenges. Identify potential design and manufacturing issues, demonstrating urgency in driving problems to resolution with thorough follow-up.
- Develop and validate effective design or process solutions to resolve identified failures. Conduct failure analysis and teardowns using common tools such as microscopes and Instron.
