Material Characterization and Failure Analysis Engineer

Minimum qualifications:

• Bachelor degree in Materials Science, Electrical Engineering, Physics, or a related field or equivalent practical experience.
• 4 years of experience operating and interpreting data from FIB/SEM and STEM to drive root cause analysis.
• 4 years of experience in a research setting or industry.

Preferred qualifications:

• MSc, or PhD degree in Materials Science, Electrical Engineering, Physics, or a related field.
• 3 years of industry experience in material characterization/failure analysis of semiconductor materials in optoelectronic applications.
• Experience working with optoelectronic characterization including EL, FL, CL, EBIC, etc, and material characterization techniques, such as EDS, XPS, SIMS, Nano SIMS, APT.
• Experience working with image processing fundamentals and computer vision techniques utilizing software packages, such as Python, MATLAB, JMP, etc.
• Knowledge of epitaxial growth, crystal structures, crystal defects, and surface chemistry.
• Knowledge of semiconductor materials and their properties.

About the job

As a Material Characterization/Failure Analysis Engineer, you will stand at the intersection of process development, yield enhancement, and reliability, serving as a critical resource for driving continuous improvement and problem solving within micro-LED manufacturing. Your primary responsibility will be to meticulously analyze and characterize materials/defects that impact device performance. You will achieve this by using a range of advanced material characterization techniques and sophisticated tools to delve into the intricate details of material microstructure and surface properties. Through failure analysis, you will identify defect patterns and trends, carefully organizing and managing microscopic images to facilitate correlative and root-cause studies. You will collaborate closely with process development, process integration, yield, and reliability teams, providing actionable insights and recommendations for process improvements. You will contribute to the development and optimization of failure analysis protocols, staying current with the latest advancements in investigative techniques. Ultimately, your role will be to unravel the mysteries of device failures, providing the essential information needed to enhance product quality, yield, and reliability.

Google's Raxium display group has established a revolutionary semiconductor materials display technology that enables new functionality in display products, bringing to users a closer and more natural linkage between the digital and physical realms in applications such as augmented reality (AR) and light-field display. With start-up roots and a state-of-the-art compound semiconductor fab in Silicon Valley, Raxium is seeking to build upon its engineering team with an aim to disrupt next-generation display markets.

Responsibilities

• Leverage your expertise in material structure, function, and advanced microscopy, to undertake testing investigations to uncover the fundamental root causes of display defectivity and lead studies into intricate material properties, complex process parameters, and their often-subtle influence on LED performance.
  
• Evaluate complex data acquired through an array of investigative techniques to build a comprehensive understanding of material and defect characteristics.
• Correlate findings from various electrical, optical, and material characterization techniques to detect defects and deduce their formation mechanisms.
• Document and summarize complex technical findings, translating them into clear, concise insights for cross-functional teams.
  
• Pioneer and drive the development of novel and advanced microscopy/failure analysis techniques in close partnership with the Failure Analysis (FA) Operation team, ensuring the continuous enhancement of investigative capabilities and guaranteeing the consistent and precise execution of sophisticated methodologies.