Minimum qualifications:
- Associate’s degree in Electrical Engineering, Computer Engineering, Physics, a related field, or equivalent practical experience.
- 2 years of experience in semiconductor process.
- 1 year of experience with failure analysis.
- Experience operating with SEM, STEM, or semiconductor deprocessing.
Preferred qualifications:
- Experience creating failure analysis reports.
- Experience with operation of metrology tools and measurements, wafer processing and processes.
- Knowledge of semiconductor wafer processing, SEM imaging, FIB/SEM, and FIB sample preparation.
- Excellent organizational skills and ability to provide clear, concise communication in a team environment.
About the job
As a Failure Analysis Technician at Raxium, you'll play a key role in pushing the boundaries of what's possible, acting as a detective, troubleshooter, and innovator to ensure our displays exceed expectations. Your expertise in failure analysis will be essential in driving process improvements, enhancing device reliability, and ultimately, bringing our goal to life.
Google's Raxium display group has established a revolutionary semiconductor materials display technology that enables new functionality in display products, bringing to users a closer and more natural linkage between the digital and physical realms in applications such as augmented reality (AR) and light-field display. With start-up roots and a state-of-the-art compound semiconductor fab in Silicon Valley, Raxium is seeking to build upon its engineering team with an aim to disrupt next-generation display markets.
The US base salary range for this full-time position is $87,000-$125,000 + bonus + equity + benefits. Our salary ranges are determined by role, level, and location. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific salary range for your preferred location during the hiring process.
Please note that the compensation details listed in US role postings reflect the base salary only, and do not include bonus, equity, or benefits. Learn more about benefits at Google.
Responsibilities
- Support failure analysis engineers and process engineers using different techniques such as Scanning Electron Microscope (SEM), Scanning Transmission Electron Microscopy (STEM), Focused Ion Beam (FIB), AFM, Low Temperature Photoluminescence (LT-PL), Manual Probe Station, and Optical Microscope.
- Use a Helios FIB/SEM tool for sample preparation and liftout as well as high resolution STEM imaging techniques.
- Learn about our device processes as you collaborate with the engineering team when troubleshooting an issue.
- Develop, maintain, and improve all troubleshooting solutions within the area of responsibility.
- Assists with development of new failure analysis techniques.
